Heat Sink Compound Manufacturer
Nimble group manufacturer’s heat sink compound for various applications based on the quantum of heat produced, thermodynamics, MOC, Viscosity etc. Along with our ready to use heat sink compound we can offer customized heat sink compound for specific new applications or critical applications.
Parameter / Property |
HC#11 |
HC# 22 |
HC#33 |
Appearance |
Semi Solid Compound |
Semi Solid Compound |
Semi Solid Compound |
Color |
White |
Grey |
Grey |
PH |
Neutral |
Neutral |
Neutral |
O.D.C. Contain at 30 °C |
0 % |
0 % |
0 % |
Moisture Content at 30°C |
0 % |
0 % |
0 % |
Operating Temperature Range |
-10°C to 230°C |
-10°C to 280°C |
-10 to 380°C |
Reactivity with metals, non-metals |
None |
None |
None |
Water Spray Off |
0.065 |
0.034 |
0,013 |
Relative Permittivity |
3 |
3 |
3 |
Bleed 24 Hrs. @ 200°C, WT.% |
0.006 % Max |
0.004 % Max |
0.03 Max |
Evaporation 24 Hrs. @ 200°C, WT.% |
0.002 % Max |
0.003 % Max |
0.002 Max |
Drop Point |
280°C |
350°C |
450°C |
VOC at 100 °C |
0% |
0% |
0% |
Thermal Conductivity at 30°C |
1.2 w/mk |
2.6 w/mk |
3.2 w/mk |
Volume Resistivity |
2* 1020 Ohm -Cm |
2* 1020 Ohm -Cm |
2* 1020 Ohm -Cm |
ARC Resistance |
150 Seconds |
150 Seconds |
180 Seconds |
Shelf Life |
2 Years |
3 Years |
5 Years |
Please contact us for details of your applications so we will suggest you right product for you application
Why Heat Sink???
In electronics applications heat sinks are used to dissipate the heat produced in electronic components, particularly microprocessors and power transistors, into the free air around. . . Heat Sink is a receiver which has infinite capacity to receive the heat without changing its temperature significantly.
So heat sink are usually chunks of metals, securely fixed against the device needing cooling, thus conducting the heat away from the device, into the metal, which then has many fins, which then dissipate that heat into the air, sometimes the air is assisted by a fan, to make a lot of air pass over those fins and take away all that heat . The internal Silicon parts must not be heated or they will be damaged.
What are the most important properties heat sink compound?
Compatibility with MOC of heat sink: Heat sink compound must be compatible with MOC of heat sink.
Highest thermal Conductivity: Heat sink compound must have excellent thermal conductivity at ambient temperature& it must be directly proportional with heat generated in the system. Higher the thermal conductivity higher the heat flow, higher the life of equipment. Heat sink compound plays important role in performance of the system. Heat sink compound must take out the entire heat generated in the system very effectively
Thermal Stability: Heat sink compound must have excellent resistance to temperature cycles . Heat sink compound should not melt in the system; it should not initiate the self heating
Consistency: Heat sink compound must have higher & constant consistency. Due to variations in system temperatures heat sink compound must not lose its viscosity, viscosity of heat sink compound must be same over wide temperature ranges.
Non Drying: Heat sink compound must not be dried till the life of the equipment or instrument
Chemical Nature: Heat sink compound must be non ionic in nature, Heat sink compound must be non hygroscopic in nature
Static Charge: Heat sink compound should not generate static charge
Mass Loss: Heat Sink compound must not lose its mass due to thermal degradation
Bleeding: Heat sink compound must have very minimum bleed for maximum system temperatures
Oxidation Resistance: Heat sink compound must have highest oxidation resistance
Reactivity: Heat sink compound must not be reactive with metals, non metals.
Service Life: Must have high service life minimum 5 years.
Nimble Heat sink compound
We had designed specialty heat sink compound for various applications. Our thermals paste are designed considering the needs of application based on amount of heat generated in the system , thermodynamics , thermal equilibrium, rate of heat transfer, thermal conductivity , temperature in the system. Heat sink compound designed & manufactured by us are used by various electronic equipments manufacturers for different applications. Apart from application requirements while designing heat sink compound we had consider & put on the priority EHS parameters. Our heat sink compound is safe to use whether it’s indoors or out door applications. Our heat sink compound is safe to use and can be used without gloves, even in long term use its non harmful to human skin. Heat sink compound manufactured by us are absolute free from VOC. Nimble heat sink compound is so safe that it can be used in closed or air conditioned rooms . Heat sink compound manufactured by us are free from ozone depleting compound. Our all thermal greases are safe to the environment. A heat sink compound manufactured by us has excellent resistance to oxidation. Nimble Heat sink compound can with stand high temperatures. Drop point of Nimble thermal greases are very high which ensures our customers for maximum safe limits within design parameters. According customer & applications requirement we had designed heat sink compound with varying viscosities. Some applications needs heat sink compound with lower viscosities so it can be applied by screen printing. We have heat sink compound with higher viscosities in the range of 600 – 1100 Poise.
Our heat sink compound never becomes brittle irrespective of its application method & thickness. Our heat sink compound offer excellent heat dissipation irrespective of the quantum of heat generated. Our thermal pastes are designed to offer excellent thermal resistance. All heat sink compound designed by us offer long term resistance to thermal degradation which ensures maximum service life .